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60G Millimeter Wave Fall Detection Radar Module HLK-LD6002C Non-contact Intelligent Monitoring with 2T2R

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Product introduction

 

HLK-LD6002C device has integrated 2 transmit and 2 receive channels, IQ down-conversion mixers, a RF VCO, a Fractional-N PLL, frequency tripler, built-in digital signal processing units, including FIR, FFT and other radar signal processing function blocks. The device includes an ARM® Cortex®-M3 Core based processor subsystem, which is responsible for radio chip configuration, control, calibration and data communications. The device is provided with a complete platform including reference design, software drivers, API guides and user documentations. The device also supports cascade-mode operation for applications that need higher accuracy and long range.

 

 

Product Features

  • Integrated PLL, Transmitter, Receiver, Baseband and ADCs

  • Operating Frequency: 57 to 64GHz

  • 2-Transmit, 2-Receive Channels

  • Ultra-Accurate Chirp (Timing) Engine Based on Fractional-N PLL

  • Tx Power @ Single Channel: 12dBm

  • 57 to 65GHz Phase Noise@1MHz offset: - 91dBc/Hz

  • Rx Noise Figure: 11dB

  • RF Built-in self-test (BIST) module, Self-calibrated System Across Frequency and Temperature

  • ARM® Cortex®-M3 Core

  • Built-in Digital Signal Process, including FIR, FFT and etc.

  • Built-in FMCW Chirp generation

  • Available IOs:

    --- 1 SPI Channels

    --- 1 CAN2.0/CAN-FD

    --- 3 UARTs

    --- 1 I2Cs

    --- Interface for analog IF output

  • Power management with low power mode

  • Digital I/O voltage 3.3V

  • Clock Source

    --- 50.0MHz Oscillator or Crystal

    --- Support external 32.768KHz crystal

    --- Internal RC Oscillator, 32KHz +/- 20%

  • Easy hardware design with 0.5mm pitch, 113-pin and 6.75mm x 6.75mm x 0.49mm fanout BGA package for small formfactor size

 

 

Applications

  • Respiratory rate monitoring

  • Human persistence monitoring

  • Gesture recognition

  • Low power carpark monitoring

 

System Block Diagram

                                                    diagram

 

Specifications

 

Signal Name Signal description Max Ratings
Unit
Min  Max
RF power  RF power  1.45 V
VDD Digital 1.2V supply  0 1.4  V
VDD12  Internal 1.2V LDO output  1.4 V
AVDD18_PLL  Internal PLL Power supply  0 2.75 V
AVDD18_PLL_VCO Internal VCO Power  0 2.75 V
AVDD18_BB1  Internal Baseband1 Power  0 2 V
AVDD18_BB2  Internal Baseband2 Power 0 2 V
VDD33  Analog 3.3V Power 0 3.63 V
DVDD33  Digital 3.3V Power 0 3.63 V
CLKP, CLKN  Input ports for reference crystal -0.5  2 V
Clamp current

Limit clamp current through the internal

diode protection of the I/O

-20 20  mA
Operating junction temperature range -40  125  °c
STG

Storage temperature range after

soldered onto PC board

-55 150 °c

(1) Stress beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods of time may affect device reliability and lifetime

 

Module Block

image

 

 

Module Size

                                                           image

 

                                                                                                                                    HLK-LD6002C  module size(unit: mm)

 

                                        image

 

                                                                                                                              HLK-LD6002C  module thickness(unit: mm)

 

Footprint Size

                                                                          image

                                                                                                                HLK-LD6002C  module footprint(unit: mm)   (TOP VIEW)

 

                                                                                                              image

                                                                                                                 HLK-LD6002C  module SMT footprint(unit: mm)  (TOP VIEW)

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