Hi-Link Semiconductor Fingerprint Recognition Module HLK-ZW0905 Capacitive Touch Fingerprint Door Lock Acquisition Sensor Module Test Kit/Development Board

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Product Details

fingerprint module select list (2) ZW0905-6 Product introduction

Consumers use fingerprint recognition modules for user identity determination. When the user touches the fingerprint recognition module with his finger, the fingerprint recognition module will

scan the user's fingerprint, and the algorithm chip can obtain the fingerprint image data for registration and comparison.

Parameters

Technical indicators

Item	Parameter
Storage	50 pieces
Sensor type	Capacitive touch sensor
Resolution	508DPI
FRR.	<3%
FAR.	<0.001%
Fingerprint sensor shape	Round
Image gray level	8-bit grayscale
Service life	Amillion times
Static electricity test	Contact discharge ±8KV/Air discharge ±15KV
Data interface	UART (TTL level)
Sensor surface hardness	3H
Working temperature and humidity range	-25℃~+70℃; 45%~85%RH
Storage temperature and humidity range	-40℃~+85℃; 45%~95%RH

Mechanical characteristics

Project	Description	Unit
Dimensions	Φ12.8mm	mm
Ribbon	5.4*4.8	mm
Resolution ratio	112*96	mm

ZW0905-04

Electrical parameters

Item		Min	Typical	Max	Unit
Supply voltage		3.0	3.3	3.6	V
Standby current (sensor)		8	10	12	μA
Operating current (algorithm MCU)		-	15	25	mA
Picture collection time		80	100	120	ms
Generate feature value time		60	80	100	ms
Comparison time		100	300	600	ms
Power-on start time		-	100	-	ms
ESD rating	Non-contact discharg	-	15	-	KV
ESD rating	Contact discharge	-	8	-	KV

Application

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Hi-Link Semiconductor Fingerprint Recognition Module HLK-ZW0905 Capacitive Touch Fingerprint Door Lock Acquisition Sensor Module Test Kit/Development Board